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Advanced Conductive & UV-Curable Materials for High-Performance Electronics

High-performance silver-filled epoxy adhesives, UV cured encapsulants, and flexible dielectric materials engineered for hybrid electronics, LED attach, printed electronics, and advanced electronic assemblies. Designed for superior conductivity, flexibility, durability, and processing efficiency, these materials deliver reliable insulation, low contact resistance, high dielectric strength, and compatibility with ZTACH® ACE systems.

Silver Filled Epoxy Adhesive

Silver Based 2-part epoxy ECA suited for applications such as hybridized electronics, flexible die attach, LED attach, printed electronics
  • Utilizes an innovative conductive filler technology and proprietary resin system, providing unmatched flexibility and adhesive bond
  • Processed at lower temperatures or in less time than most traditional ECA technologies
  •  Enables improved throughput with higher sheet strength and high flexibility
  •  Low contact resistance
  •  Non out-gassing
  •  100% solids/solvent free

UV Cured Encapsulants

  • Dynamically flexible
  • High dielectric breakdown-975 volts at 25 microns
  • Optically clear
  • Water submersible
  • Autoclavable
  • ZTACH® ACE compatible formulations

UV Cured Dielectrics

  • Dynamically Flexible
  • Highly elastic TPU resin
  •  High dielectric insulation
  • ZTACH® ACE compatible formulations
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Material Properties

Substrate:This material has good adhesion to all flexible film and
rigid printed boards commonly used in printed electronics

Percent Solids:100%

Viscosity:3000 cP (@60RPM) +/- 5% with SC4-27 spindle

Operating Temperature:-40C to +85C

Dielectric Constant:4.01 @10Hz

Dielectric Strength:975 volts/25 microns

Tensile Strength:1220 psi @ 24C

Hardness:Shore D 50-60

Water Absorption:0.96% weight gain @ 24 hours submersion

Processing Guidelines

Dispensing Equipment:Manual Semi or fully automatic

Curing Conditions:600 ± 30 millijoules/cm2 Millijoules typical but customer
should evaluate cure properties specific to their production
equipment. Cured material should be dry and not be tacky
to touch.

Clean Up Solvent:Isopropyl Alcohol

Storage and Shelf Life

This material is polymeric and should be stored between 40 and 75° F in unopened containers. Shelf life is for six
(6) months under these conditions. Once opened the material should be used within 4 weeks.

Safety and Handling

This product contains organic solvents and materials. The following precautions should be exercised
when handling this material:
1. Use with adequateventilation.
2. Avoid prolonged contact with skin.
3. Avoid prolonged respiratory exposureto vapors.
4. If contact with skin occurs, wash affected area immediately with soap and water.
5. Do not consume – dangerous if swallowed.