ZTACH® ACE and ZMAG® Magnetic Pallet Interconnect Solution


  • Enabled by the innovation of our ZMAG® Magnetic Pallet, ZTACH® ACE achieves z-axis particle alignment within 10 seconds to create an anisotropic electrical and mechanical bond between component and circuit.
  • Fine-pitch interconnections down to 100μm
  • 5-10x increase in bond strength
  • No patterning or pressure required
  • Reduced cost through low conductive particle loading
  • Contact resistance between 7-20 mOh-cm
  • Low temperature and UV cure options
  • Broad substrate compatibility
  • Easily adaptable into most SMT manufacturing lines
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Conductive Column Formation

ZTACH® ACE conductive column formation within 10 seconds prior to cure. 

BEFORE CURE

Randomly dispersed
particles

WITHIN 4 SECONDS

Particles align with
magnetic field exposure

WITHIN 10 SECONDS

Conductive columns
fully form

ZTACH® ACE Value Proposition

Design Benefits

  • Reduced part complexity
  • Thermal dissipation
  • Self-underfilling
  • Superior Adhesion
  • Fine pitch down to 100 microns

Engineering Benefits

  • No outgassing
  • Environmentally Stable
  • Rad and cryogenic stability
  • RF performance up to 90GHz
  • Low temperature and UV cure options

Manufacturing Benefits

  • Easily adaptable to most SMT manufacturing lines
  • Anisotropic without pressure
  • Coplanarity not required
  • No patterning
  • Improved yields
  • Higher manufacturing throughput

Our Fully Automated ZTACH® ACE SMT Process

ZMAG® Magnetic Pallet Enables ZTACH® ACE Process

  • Easily integrated in a standard SMT process

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