SunRay Scientific is a Global Materials Technology Company Specializing in Unique & Novel Anisotropic Conductive Adhesives
The ZTACH® ACE and ZMAG® Magnetic Pallet Interconnect System is the key to our ability to enable a high-performance interconnect solution, easily integratable into existing manufacturing infrastructure. By combining custom formulation chemistry, scalable manufacturing, and application-specific engineering support, SunRay Scientific empowers global OEMs and technology leaders to bring smaller, lighter, faster, and more reliable electronic products to market.
Our Story
From our start over 10 years ago, we have developed technology changing solutions and innovations. Our mission is to provide innovative technology solutions to meet your complex electrical interconnect and printed electronic needs. SunRay Scientific’s state-of-the-art facility located in Wall Township, NJ is well positioned for materials manufacturing, prototyping, and in-house customer qualification.
Led by Madhu Stemmermann (CEO) and Andrew Stemmermann (CTO), SunRay Scientific provides innovative materials and processes that enable printed electronics across various industries, including automotive, healthcare, smart labels, and sensors.
Meet Our Experts
Our multidisciplinary team brings together material science expertise, application engineering, and manufacturing insight to help customers move confidently from concept and prototyping to scalable, production-ready electronics. From ZTACH® ACE anisotropic conductive adhesives to conductive inks, epoxies, and encapsulants, our engineering team can help you design a process for integrating our other technologies into your products.
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- 25+ years of experience in senior leadership roles across sales, manufacturing, supply chain, engineering and product management.
- Focus areas include: environmental health & safety, customer focus, quality, lean six sigma.
- She has worked across various industries such as medical devices, lighting and electronics with Becton Dickinson, Air Products, Honeywell and General Electric.
Madhu Stemmermann
CEO, Co-Founder
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- 25+ years of experience in mechanical engineering, application development and formulation development of conductive adhesives.
- Focus areas include: application development, formulation and process development of conductive adhesives.
- He is the developer of ZTACH ® ACE formulations and magnetic pallet design and processes.
Andrew Stemmermann
CTO, Co-Founder
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- 25+ years’ experience in the printed electronics and conductive materials industry.
- Held roles as Global Business Manager, Business Development Manager, Global Key Accounts Manager.
- Experience in leading successful start-ups and new product innovation.
John M Yundt
VP of Sales and Business Development
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- Dean of the College of Engineering Technology ENT at the Rochester Institute of Technology (RIT).
- He has over 15 years’ experience in Electronics Packaging and Research and lead the pioneering efforts in using ACAs for PCB level electronics.
S. Manian Ramkumar, Ph.D
Technical Advisor
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- Over 20 years building and growing companies from start up through mid/ large scale global corporations in fast paced, highly regulated markets.
- Focused on building operations that ensure customer satisfaction through a data driven, entrepreneurial approach that empowers personal and team ownership.
Jay Watson
VP of Engineering and Operations
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- 25 years’ manufacturing and engineering experience in the electronics industry.
- Broad experiences ranging from small startup company launch to directing operations teams at fortune 500 companies.
- Skilled at bringing new technologies from concept through commercialization.
Matthew Foster
Director of Operations and Engineering
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- 35+ years of experience in polymer thick films
- Bell Fellow at Lucent. Technologies.
- Inventor of ZTACH® ACE technology.
Kumar Khanna, Ph.D.
CTO, Emeritus
Our goal was to electrically connect sensors to printed circuit boards without relying on wire bonding. Despite numerous attempts with various conductive tapes and adhesives from well-known vendors, we encountered inconsistent bond pad contacts and unreliable electrical properties. However, after just one trial with SunRay Scientific’s ZTACH® ACE adhesive, we achieved uniform and consistent electrical contacts. We have adopted this adhesive as our standard process for R&D and will transfer it to high-volume manufacturing. It has proven to be remarkably easy to use, fast, consistent, and transferable, truly a game changer in the assembly of electronic devices.
— Dr. Trevor J. Morin, PhD
VP R&D — GrapheneDx, Inc.
GrapheneDx, Inc.
BGM Engineering has successfully specified and implemented Sunray Scientific’s FlexS‑FSZC‑SF4 silver ink and ZTACH® ACE anisotropic materials in our next‑generation printed circuitry programs. We have produced and assembled prototype circuit boards using our existing pick‑and‑place equipment, validating both performance and manufacturability. These materials are now supporting multiple high‑volume IoT devices planned for production, with additional LED lighting applications showing strong early results. SunRay’s materials have proven to be a reliable and scalable solution for our advanced electronics programs.
— Joseph Mazur
Vice President of Engineering — BMG Engineering, Inc.
BGM Engineering, Inc.