High-Performance Conductive Materials for Sensors & Instrumentation
Technical Barriers in Traditional Sensor Manufacturing Processes
Yield
Yield loss due to thermode pressure inaccuracies creating component placement failures
Throughput
Manufacturing throughput bottle necks due to small number of component placements per minute and thermal bonder cycle times
Total Mfd. Cost
Drastic increases in silver cost and high % solids in ACP materials with need for additional encapsulation creates higher weight & cost per part
RFID Attach: ZTACH® ACE vs Validated value proposition:
- Mfg. throughput drastically increased due to huge increase in number of component placements at one time, along with decrease in cycle times with UV cured solution results in 5-10x increases in mfg. throughput
- ZTACH® ACE contains less than 5% silver with a total density at 25% of traditional ACP materials, and it does not require encapsulation, thus a reduction in per unit cost
- CapEx to manufacture is 25-50% less in most mfg. environments
- 3-4 days pot life versus 1-day with most ACP materials results in 3-4x reduction in waste, more efficient mfg
In a study using UV ZTACH® ACE for fire pitch wire and sensor attach for continuous glucose monitoring device, we validated the value proposition:
- 80% reduction in mfg. cycle time with UV ZTACH® ACE
- 40%-60% reduction in mfg. space required for UV or Thermal ZTACH® solution
- Increases number of wire or sensor to PCB connections by 2 to 4x within the same space with improved yield (component pitch down to 90 µm)
- Reduction in manufacturing process steps by eliminating need for underfill
- 4x Increase in bond strength
- =/>30% decrease in contact resistance
High-Density Micro-Sensor Interconnects
The Challenge: Achieving reliable connectivity in miniaturized high-performance electronics without causing electrical shorts or mechanical damage.
The SunRay Solution: Our specialized conductive materials are engineered for critical assembly processes. By utilizing a pressure-less attach method, we eliminate the common risks of wire sweep, bending, or displacement. This ensures that every component stays in its intended position, even at a fine pitch down to 50 microns.
Precision Alignment: Automatically absorbs skew and surface gaps between wires and contact pads to prevent shorting.
Structural Integrity: Provides full encapsulation and significantly improves surface bond strength for long-term reliability.
Industrial Instrumentation & Robust Encapsulation
The Challenge: Protecting sensitive sensor circuitry from mechanical strain, vibration, and thermal fatigue in harsh industrial environments.
The SunRay Solution: SunRay Scientific’s high-performance epoxies and encapsulants provide a protective fortress for your instrumentation. Our unique chemistry offers superior strain relief by encasing both the wire and the sheathing.
Thermal Safety: Our low-heat application ensures no overheating of wire sheathing or metal pad peeling, preserving the substrate’s integrity.
Enhanced Durability: The encapsulation process creates a ruggedized bond that withstands intense industrial use while maintaining signal accuracy.
High-Throughput Manufacturing for Advanced Sensors
The Challenge: Meeting the demand for faster production cycles without compromising the delicate high-density architecture of modern sensors.
The SunRay Solution: Scale your production with a faster process and greater throughput. Our materials are designed for rapid integration into automated assembly lines, offering a “set-and-forget” reliability that reduces rework and scrap rates.
Seamless Integration: Designed to absorb misalignment and surface gaps automatically, reducing the need for manual micro-adjustments.
Optimized Production: Achieve high-performance results with a streamlined application process that minimizes the stress on high-density contact pads.
Request Product Information & Technical Consultation
Connect with our technical team to discuss specifications, compatibility, and application requirements. Get expert guidance and tailored recommendations for your project.