SEMI-FlexTech, the industry-led public-private partnership dedicated to advancing the flexible and printed electronics (FHE) ecosystem, has announced a new set of research and development projects focused on novel interconnect and system-integration strategies designed to accelerate the transition of breakthrough technologies into commercial, market-ready products.
The newly announced initiatives span ultra-thin flexible batteries, printed audio speaker systems, and advanced flexible fan-out wafer-level packaging (FOWLP), addressing key challenges in power delivery, signal integration, form factor reduction, and scalable manufacturing for next-generation electronic systems.
Driving Infrastructure for World-Class Flexible Electronics Manufacturing
According to Dr. Melissa Grupen-Shemansky, SEMI Chief Technology Officer for flexible electronics and advanced packaging, the SEMI FlexTech R&D program plays a critical role in building the infrastructure required to support high-volume, world-class manufacturing of flexible hybrid electronics devices.
She noted that these projects represent the cutting edge of heterogeneous integration, advanced packaging, and flexible interconnect technologies, while demonstrating how cross-industry collaboration accelerates innovation and commercialization.
Ultra-Thin Flexible Battery Project for Sensor-Driven Applications
One of the newly launched projects is led by ITN Energy Systems, in collaboration with Molex, ENrG, SunRay Scientific, and the University of Rhode Island. The goal is to develop ultra-thin charge control circuitry integrated into an optimized, lightweight, flexible battery that functions as a renewable, self-recharging power source for mobile and sensor-based applications.
Compared to conventional commercial batteries, the power package is expected to deliver a smaller footprint, faster response time, improved sensitivity, reduced power consumption, and broader operating temperature and humidity ranges. The team will initially demonstrate a monolithically integrated power module that combines ultra-thin charge control circuits with photovoltaics, followed by integration of a sensor system directly within the battery structure.
The project roadmap includes the development of a fully functional power module containing a sensor, signal processing, and telemetry, all within a package measuring less than 250 microns thick. The initiative is scheduled to run for 15 months with total funding of $2.4 million, supported by a 48 percent industry cost share.
Advanced Fan-Out Wafer-Level Packaging for Biomedical Applications
A second newly announced project is led by UCLA, in partnership with i3 Microsystems, and focuses on the development of a next-generation electromyography (EMG) electrode array for identifying muscle fatigue in training combatants and enabling rehabilitation therapies for neural trauma and neuropathic disorders.
The team will create a biocompatible electrode array and commercial CMOS chip integrated using fan-out wafer-level packaging (FOWLP). This approach supports heterogeneous integration in a compact form factor, while biocompatibility is achieved through a newly developed molding compound tailored for wearable and biomedical environments.
The project is planned for an 18-month duration with total funding of $1 million, supported by a 50 percent cost share, and is designed to advance small-form-factor, high-performance biomedical electronics toward real-world deployment.
Strengthening the Flexible and Printed Electronics Ecosystem
Together, these projects reinforce SEMI-FlexTech’s role in advancing flexible hybrid electronics, advanced packaging, and integrated power solutions across industries such as wearable technology, defense, healthcare, and IoT sensor systems. By combining novel materials, interconnect strategies, and scalable manufacturing processes, the initiatives aim to close the gap between laboratory innovation and commercial FHE product adoption.
Through continued collaboration between industry leaders, research institutions, and technology providers like SunRay Scientific, SEMI-FlexTech continues to drive progress toward a more agile, scalable, and market-ready flexible electronics ecosystem.
Reference Article link: https://www.semi.org/en/semi-flextech-funds-new-cutting-edge-projects-flexible-electronics
