SunRay Scientific is a Global Materials Technology Company specializing in Unique & Novel Anisotropic Conductive Adhesives.
We offer the best anisotropic conductive adhesives, electrically conductive silver epoxy with fast room temperature cure, high-speed drying conductive silver ink and optically clear encapsulants for flexible electronics. Our advanced materials science company has served in multiple industries like Flexible & Wearable Electronics, Automotive Electronics, Energy & Power Devices, Industrial Electronics, Medical & Bioelectronic Devices, micro-assembly, and X-ray imaging applications and much more.
Z-TACH® ACE Anisotropic Conductive Epoxy, paired with our patented ZMAG® Magnetic Pallet System is the heart of our materials expertise. It is a high-performance solution built to support pressure-free, low-temperature, high-reliability electronic interconnections using existing manufacturing infrastructure. By combining custom formulation chemistry, scalable manufacturing, and application-specific engineering, SunRay Scientific empowers global OEMs and technology leaders to bring smaller, lighter, faster, and more reliable electronic products to market.
Years of Experience
Our team brings over two decades of expertise in custom conductive adhesives, anisotropic conductive epoxies, and printed electronics materials, supporting global manufacturers with reliable, low-temperature interconnect solutions since 2010.
Satisfied Clients
Trusted by OEMs and engineering teams worldwide for high-performance conductive inks, silver epoxies, and Z-TACH® ACE solutions used in medical devices, X-ray imaging, flexible electronics, and advanced packaging applications.
Skilled Professionals
A dedicated team of material scientists, chemical, electrical, and mechanical engineers focused on designing custom adhesive formulations and magnetic pallet systems that integrate seamlessly into existing manufacturing processes.
Client Success
Custom patented Z-TACH® ACE anisotropic conductive epoxies and printed electronics materials built for high-precision performance, long-term reliability, and scalable production.
Our Story
From our start in AT&T Bell Labs over 20 years ago, we have developed technology changing solutions and innovations. Our mission is to provide innovative technology solutions to meet your complex electrical interconnect and printed electronic needs. SunRay Scientific’s state-of-the-art facility located in Wall Township, NJ is well positioned for materials manufacturing, prototyping, and in-house customer qualification.
Led by Madhu Stemmermann (CEO) and Andrew Stemmermann (CTO), SunRay Scientific provides innovative materials and processes that enable printed electronics across various industries, including automotive, healthcare, smart labels, and sensors.
From our start in AT&T Bell Labs over 20 years ago, we have developed technology changing solutions and innovations. Our mission is to provide innovative technology solutions to meet your complex electrical interconnect and printed electronic needs.
SunRay Scientific’s state-of-the-art facility located in Wall Township, NJ is well positioned for materials manufacturing, prototyping, and in-house customer qualification.
Led by Madhu Stemmermann (CEO) & Andrew Stemmermann (CTO), SunRay Scientific provides innovative materials and processes that enable printed electronics across various industries, including automotive, healthcare, smart labels, and sensors.
Founded in 2012, Sunray Scientific Inc. is a global materials manufacturing company providing novel, conductive adhesive solutions for advanced electronic packaging across printed electronics & semiconductor packaging.
At Sunray Scientific, we are a solutions provider that addresses many different key aspects in the industry. So we are different from other companies where we can actually provide materials and the end processes that enable printed electronics and semiconductor applications. Sunray Scientific’s state-of-the-art prototyping and manufacturing facility located in Eatontown, New Jersey is well positioned and equipped for production volume capability, alpha and beta testing validation, and in-house customer qualification. We have designed a new facility that we just moved into that has different manufacturing lines. We have our SMT line, we have our die placement line, and we also have our print electronics line. In addition to that, we are able at Sunray Scientific to manufacture high volume conductive materials.
Sunray has an automated SMT line, ASM C-Place, deck printer, Heller ovens, testing equipment along with a Class 8 cleaning room equipped with an SM Tech and Fine Tech Lambda pick and place. Our technology works extremely well in high volume production. We create productivity. We’ve been able to eliminate a variety of steps, things such as underfilling, things such as patterning. We don’t require solder bumping. We are our own underfill with our technology so that we are eliminating many steps and creating tremendous productivity. Z-TACH® ACE is a magnetically alignable conductive adhesive. It’s a polymer matrix that has highly conductive ferromagnetic particles that when we excite it with our magnetic ZMAG pallet, it integrates Z-axis connections for electronics.
SunRay Scientific partners with engineers, OEMs, research institutions, and manufacturers worldwide to deliver advanced functional material solutions that integrate seamlessly into real-world production environments.
Our multidisciplinary team brings together material science expertise, application engineering, and manufacturing insight to help customers move confidently from concept and prototyping to scalable, production-ready electronics. From ZTACH® ACE anisotropic conductive adhesives to conductive inks, epoxies, and encapsulants, Our engineering team can help you design a process for integrating ZTACH® ACE and our others technologies into your products.
Meet Our Experts
At SunRay Scientific, innovation is driven by people who understand both materials at the molecular level and how those materials perform in your manufacturing environment. Our team includes chemists, materials engineers, process specialists, and application experts with deep experience across printed electronics, flexible and wearable devices, automotive electronics, sensors, energy systems, industrial electronics, and advanced R&D programs.
This collaborative approach allows us to support customers across the U.S. and global markets, ensuring faster development cycles, reduced risk, and dependable outcomes.
Collaborative Expertise
Driven by cross-functional teamwork, our experts collaborate closely with customer engineering teams to solve complex application challenges and accelerate innovation.
Technical Excellence
We deliver high-quality results through deep material knowledge, rigorous testing, and continuous process optimization aligned with industry standards.
Andrew Stemmermann
CTO, Co-Founder
John M Yundt.
VP of Sales and Business Development
S. Manian Ramkumar, Ph.D
Technical Advisor
Matthew Foster
Director of Operations and Engineering
Kumar Khanna, Ph.D.
CTO, Emeritus
VIEW DETAILS
- 25+ years of experience in senior leadership roles across sales, manufacturing, supply chain, engineering and product management.
- Focus areas include: environmental health & safety, customer focus, quality, lean six sigma.
- She has worked across various industries such as medical devices, lighting and electronics with Becton Dickinson, Air Products, Honeywell and General Electric.
Madhu Stemmermann
CEO, Co-Founder
VIEW DETAILS
- 25+ years of experience in mechanical engineering, application development and formulation development of conductive adhesives.
- Focus areas include: application development, formulation and process development of conductive adhesives.
- He is the developer of ZTACH ® ACE formulations and magnetic pallet design and processes.
Andrew Stemmermann
CTO, Co-Founder
VIEW DETAILS
- 25+ years’ experience in the printed electronics and conductive materials industry.
- Held roles as Global Business Manager, Business Development Manager, Global Key Accounts Manager.
- Experience in leading successful start-ups and new product innovation.
John M Yundt
VP of Sales and Business Development
VIEW DETAILS
- Dean of the College of Engineering Technology ENT at the Rochester Institute of Technology (RIT).
- He has over 15 years’ experience in Electronics Packaging and Research and lead the pioneering efforts in using ACAs for PCB level electronics.
S. Manian Ramkumar, Ph.D
Technical Advisor
VIEW DETAILS
- 25 years’ manufacturing and engineering experience in the electronics industry.
- Broad experiences ranging from small startup company launch to directing operations teams at fortune 500 companies.
- Skilled at bringing new technologies from concept through commercialization.
Matthew Foster
Director of Operations and Engineering
VIEW DETAILS
- 35+ years of experience in polymer thick films
- Bell Fellow at Lucent. Technologies.
- Inventor of ZTACH® ACE technology.
Kumar Khanna, Ph.D.
CTO, Emeritus
Our Mission
SunRay Scientific is dedicated to pioneering innovative, high-performance materials for printed and flexible electronics, including advanced conductive inks, encapsulants, and anisotropic conductive adhesives like Z-TACH® ACE. We simplify complex assembly processes, reduce manufacturing barriers, and deliver cost-effective, environmentally stable solutions that enhance yield, throughput, and durability for applications in wearables, RFID, fine-pitch interconnects, and beyond, empowering manufacturers to create reliable, next-generation electronic devices.
Our Vision
To become the global leader in interconnect technologies, revolutionizing the electronics industry by enabling seamless, sustainable integration of flexible and hybrid systems that drive innovation, accessibility, and efficiency across diverse sectors, from consumer wearables to advanced industrial applications.
Our goal was to electrically connect sensors to printed circuit boards without relying on wire bonding. Despite numerous attempts with various conductive tapes and adhesives from well-known vendors, we encountered inconsistent bond pad contacts and unreliable electrical properties. However, after just one trial with SunRay Scientific’s ZTACH® ACE adhesive, we achieved uniform and consistent electrical contacts. We have adopted this adhesive as our standard process for R&D and will transfer it to high-volume manufacturing. It has proven to be remarkably easy to use, fast, consistent, and transferable, truly a game changer in the assembly of electronic devices.
— Dr. Trevor J. Morin, PhD
VP R&D — GrapheneDx, Inc.
GrapheneDx, Inc.
Dr. Trevor J. Morin, PhD
VP R&D — GrapheneDx, Inc.Our goal was to electrically connect sensors to printed circuit boards without relying on wire bonding. Despite numerous attempts with various conductive tapes and adhesives from well-known vendors, we encountered inconsistent bond pad contacts and unreliable electrical properties. However, after just one trial with SunRay Scientific’s ZTACH® ACE adhesive, we achieved uniform and consistent electrical contacts. We have adopted this adhesive as our standard process for R&D and will transfer it to high-volume manufacturing. It has proven to be remarkably easy to use, fast, consistent, and transferable, truly a game changer in the assembly of electronic devices.
Joseph Mazur
Vice President of Engineering — BMG Engineering, Inc. MichiganBGM Engineering has successfully specified and implemented Sunray Scientific’s FlexS‑FSZC‑SF4 silver ink and ZTACH® ACE anisotropic materials in our next‑generation printed circuitry programs. We have produced and assembled prototype circuit boards using our existing pick‑and‑place equipment, validating both performance and manufacturability. These materials are now supporting multiple high‑volume IoT devices planned for production, with additional LED lighting applications showing strong early results. SunRay’s materials have proven to be a reliable and scalable solution for our advanced electronics programs.
BGM Engineering has successfully specified and implemented Sunray Scientific’s FlexS‑FSZC‑SF4 silver ink and ZTACH® ACE anisotropic materials in our next‑generation printed circuitry programs. We have produced and assembled prototype circuit boards using our existing pick‑and‑place equipment, validating both performance and manufacturability. These materials are now supporting multiple high‑volume IoT devices planned for production, with additional LED lighting applications showing strong early results. SunRay’s materials have proven to be a reliable and scalable solution for our advanced electronics programs.
— Joseph Mazur
Vice President of Engineering — BMG Engineering, Inc. Michigan
GrapheneDx, Inc.
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Our Mission
Interconnect Applications
- Hybrid electronics
- Flexible die attach
- Compact form factors
- 3D stacking
- Non-planar bonding
- Printed Electronics
Material Performance
- Controlled conductivity
- Thermal efficiency
- Insulation integrity
- Mechanical flexibility
- Long-term reliability
- Process consistency
Manufacturing Compatibility
- Low-force bonding
- Fine-feature tolerance
- Flexible cure options
- Rapid processing
- Equipment compatible
Assembly Optimization
- Reduced process steps
- Simplified integration
- Multi-material support
- Yield improvement
- Scalable deployment