Fine-Pitch Solutions for High-Performance Automotive Electronics
Advanced Conductive Materials for Automotive-Electronics
Miniaturization
Demand for technology that enables size and weight reduction of automotive systems, as additional functionalities like ADAS are added
Cost Reduction
Conventional techniques like ECA and wire bonding require many steps in the manufacturing process, increasing costs
Reduced Part Complexity
Allows for added functionality without increasing weight or cost
ADAS Sensor Attach: ZTACH® ACE vs Standard Wire Bonding
Integrated FHE process for bonding a CMOS chip for Automotive Optical Sensing directly to a flex circuit. Validated value proposition:
- Equivalent performance to current technology
- Reduction in parasitic contamination translating into reduced signal loss
- Elimination of costly wire bonding process
- ~75% reduction in size, ~80% reduction in weight, & ~60% reduction in cost
LED Ambient Light Panel: ZTACH® ACE vs Standard ECA
Enables a fully integrated printed electronics solution on lightweight, thin, and formable substrates. Two current projects to integrate high density, fine-pitch LED’s onto printed flexible circuitry validated the value proposition:
- Enables use of smaller LED’s for less power consumption and more uniformed light output
- Elimination of patterning increases mfg. yield
- More robust technology increased total reliability
- ~20% cost reduction compared to current ECA solution in use
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Engineered for the Road: High-Reliability Interconnects for EV & ADAS Systems
In the rapidly evolving landscape of Electric Vehicles (EV) and Advanced Driver Assistance Systems (ADAS), electronics must withstand extreme thermal cycling and constant mechanical vibration. Sunray Scientific provides specialized conductive adhesives and high-performance encapsulants designed to secure critical sensors, cameras, and power modules. Our ZTACH® ACA technology offers a low-temperature bonding alternative to traditional reflow soldering, protecting heat-sensitive components while ensuring robust electrical pathways. From battery management systems (BMS) to autonomous radar arrays, we deliver the material durability required for AEC-Q100 compliance and long-term vehicle safety.
Thermal Management & Ruggedization for Next-Gen Automotive Control Units
As automotive architectures move toward centralized compute and high-density power electronics, managing heat and structural integrity is paramount. Sunray Scientific’s thermal interface materials (TIMs) and structural epoxies are engineered to dissipate heat efficiently while providing superior moisture and chemical resistance. Our conductive inks and shielding materials enable the development of lightweight, flexible circuits for smart cockpits and haptic touch controls, reducing vehicle weight without sacrificing performance. By partnering with Sunray, automotive manufacturers can achieve higher production yields and develop ruggedized electronic control units (ECUs) that perform flawlessly in the most demanding road conditions.